FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations
April 26, 2022 | SEMIEstimated reading time: 1 minute
FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics. The event will co-locate with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.
Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX Conference has consistently helped turn great ideas into game-changing applications for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are excited to co-locate FLEX with SEMICON West Hybrid to advance the integration of traditional rigid electronics with flexible electronics to improve the way the world works and lives.”
Advances in sustainability across both industries will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devices more eco-friendly.
FLEX Conference 2022 Breakout Sessions
- FHE Applications
- Flexible MedTech and Wearables
- Printing and Processing
- Reliability and Inspection
- Strategies and Sustainability
- Flexible Conductive Materials and Inks
- Flexible Power
- FHE Processing and Integration
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.
Suggested Items
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.