Rise of High-Performance TIMs in ADAS and Data Centers, Reports IDTechEx
April 5, 2023 | PRNewswireEstimated reading time: 2 minutes
Thermal Interface Materials (TIMs) come in different forms and thermal conductivities. Typical TIM forms include gap pads, thermal greases, thermally conductive adhesives (TCA), and phase change materials.
The adoption of advanced driver assistance systems (ADAS) has gained significant momentum recently. An ADAS needs a suite of electronics such as radar, LiDAR, cameras, and electronic control units (ECUs). All of these components can generate a large amount of heat and hence require efficient heat transfer. The application area of TIMs in different components can vary. For instance, TIMs are typically used between electronics and their enclosure in radars, but for LiDAR, TIMs are used in both PCBs and laser diodes.
At this stage, the choice of TIMs in ADAS sensors can vary significantly depending on their types, locations, and overall design of the unit. As ADAS sensors are typically produced at a large volume, a dispensable product (e.g., gap filler or thermal grease) is typically the best choice because this allows for automated application and assembly. As expected, the thermal conductivity of a TIM is highly related to the power of the ADAS components. The trend towards higher image quality, greater processing ability of ECUs/chips, and the increasing adoption of Gallium nitride (GaN) field-effect transistors (FETs) in laser drivers drives the growth in thermal conductivities/high-performance TIMs in many circumstances.
Thermal Conductivity of TIMs in different ADAS components: Now and Future. Source: IDTechEx - "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
Similar to ADAS, TIMs in data centers are also seeing a similar trend. Over the past decade, the thermal design power (TDP) of GPUs has increased steadily, and with the increasing popularity of AI chips, cloud computing, blockchain, and crypto mining, IDTechEx believes that the power density of chips and data centers will grow fast. This leads to several trends in high-performance TIMs used in data centers.
- High Thermal Conductivity: TIMs with thermal conductivity greater than 5 W/mK are preferred for high-performance applications.
- Compatibility and Stability: Many server boards have started to incorporate cold plates; therefore, TIMs must be stable and durable under harsh conditions such as high temperatures and humidity. TIMs that can withstand temperatures of up to 200°C and have a long shelf life are preferred.
- Easy Application: Similar to ADAS sensors, servers are typically manufactured at a large volume. TIMs should be easy to apply or automate. Therefore, dispensable TIMs such as grease and gap fillers are commonly used for this purpose.
In conclusion, for data centers and ADAS, IDTechEx believes that high-performance TIMs are expected to be increasingly adopted to handle fast-growing power density. High-performance TIMs also indicate a high unit price, thereby driving a fast increase in total revenue. IDTechEx forecasts that the revenue of TIMs in ADAS and data centers will have a 15-fold increase from 2020 to 2033. More details about the opportunities associated with this transition are included in IDTechEx's latest research, "Thermal Interface Materials 2023-2033: Technologies, Markets and Opportunities".
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
Altair Acquires Cambridge Semantics, Powering Next-Generation Enterprise Data Fabrics and Generative AI
04/22/2024 | AltairAltair a global leader in computational intelligence, acquired Cambridge Semantics, a modern data fabric provider and creator of one of the industry’s leading analytical graph databases.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.