American Standard Circuits Now Offers ENEPIG Surface Finish
September 18, 2023 | American Standard CircuitsEstimated reading time: 1 minute
Illinois-based PCB fabricator, American Standard Circuits, is now offering in-house ENEPIG surface finish. ENEPIG is the solution to multiple surface finish requirements within one multi metal plating operation.
Utilizing nickel as the traditional barrier layer, the Electroless Palladium creates a buffer between the nickel and the gold. This prevents the interaction of the corrosion of the nickel to allow the ion exchange necessary for the Immersion gold. In a traditional ENIG process the nickel is corroded in order to exchange the nickel surface for the immersion gold reaction (reduction). This can lead to intergranular corrosion of the nickel, particularly where the phosphorous and the nickel meet within the co-deposition of nickel and phosphorous (6-9%).
Using Electroless Palladium, the gold is deposited in a partial immersion process (corrosion) which becomes autocatalytic after the initiation of plating of the gold. This removes any corrosion of the nickel and the subsequent risk of Black Pad. In addition to the obvious risk mitigation, it also provides a highly solderable and wire bondable surface without the use of multiple plated thicknesses of electrolytic soft gold. Typically, a thinner gold for solderability (<10µ”) and a thicker deposit for wire bondability (>50µ”).
The ENEPIG process provides the best of both worlds in a single process sequence as well as complete encapsulation of all copper features.
Educational titles from American Standard Circuits:
- The Printed Circuit Designer’s Guide to…?Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
-
Visit I-007eBooks.com?to download these and other free titles.
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.