The Knowledge Base: A CM’s Perspective on Box Build Practices
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Nolan’s Notes: Do More, Get MoreJohn Mitchell Addresses Industry Workforce Challenges with U.S. Department of Commerce
February 19, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
IPC’s efforts in government relations and advocacy have been pivotal in getting legislation like the CHIPS Act passed. IPC has coined the phrase “silicon to systems” to highlight that things like chips can only function within a complete electronics system, which depends on a much broader electronics supply chain than just semiconductors. They continue to work ardently to make sure our industry’s voices are heard.
In February, IPC President and CEO Dr. John W. Mitchell was back in Washington, D.C., representing our industry in a meeting convened by the U.S. Department of Commerce, where he discussed workforce issues and how to ensure that our businesses have the workforce they need. In this audio interview, he reviews his concerns and solutions on workforce development.
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The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.