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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

Incap US Hosts Annual Food Drive

04/30/2024 | Incap
Incap US recently concluded its annual food drive, a tradition aimed at supporting the Greater Washington County Food Bank. This year marked the fourth year of the initiative, and we couldn’t be prouder of the collective effort that was made to its success.

Airbus Expands its Earth Observation Constellation with Pléiades Neo Next

04/29/2024 | Airbus
Airbus has launched the Pléiades Neo Next programme to expand its very high resolution Earth observation constellation. This new programme will result in new satellite assets and capabilities, including enhanced native resolution.

SIA Commends CHIPS Act Incentives for Micron’s Manufacturing Projects in New York and Idaho

04/29/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Micron.

Amphenol Reports Q1 2024 Results, Announces New Stock Repurchase Program

04/26/2024 | BUSINESS WIRE
Amphenol Corporation reported first quarter 2024 results. In addition, the Company is announcing a new three-year, $2 billion stock repurchase program.
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