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Karl's Tech Talk: Laser Process Applications in Electronics
Figure 1 shows several laser imaging techniques, some are commercial, some are developmental. The best-known process is laser direct imaging (LDI), whereby photoresist or soldermask is exposed pixel-by-pixel without the use of a phototool.
Laser ablation processes are highlighted in green. Laser ablation approaches differ by laser source and in the type of material being ablated. Ablation of dielectric, or metal, or resist (metal etch resist such as immersion tin, organic non-imageable resist, or selected areas of exposed photoresist) are examples of ablation techniques that differ in the material being ablated.
Figure 1: Overview of laser structuring techniques.
This column originally appeared in the March 2013 issue of The PCB Magazine.
More Columns from Karl's Tech Talk
Karl's Tech Talk: Digital Imaging UpdateKarl’s Tech Talk: Electronic Packaging Levels
Green Legislation and the Impact on Electronic Materials and Processes
Digital Imaging Revisited
Dry Film Photoresist Thickness Selection Criteria
Quick-Turn Circuit Board Shops
Optical Interconnects
Signal Loss