The Conference Board LEI for the U.S. Increased in July
August 22, 2019 | The Conference BoardEstimated reading time: 1 minute
The Conference Board Leading Economic Index (LEI) for the U.S. increased 0.5% in July to 112.2 (2016 = 100), following a 0.1% decline in June, and a 0.1% decline in May.
“The US LEI increased in July, following back-to-back modest declines. Housing permits, unemployment insurance claims, stock prices and the Leading Credit Index were the major drivers of the improvement,” said Ataman Ozyildirim, Senior Director of Economic Research at The Conference Board. “However, the manufacturing sector continues exhibiting signs of weakness and the yield spread was negative for a second consecutive month. While the LEI suggests the US economy will continue to expand in the second half of 2019, it is likely to do so at a moderate pace.”
The Conference Board Coincident Economic Index (CEI) for the U.S. increased 0.2% in July to 106.2 (2016 = 100), following a 0.2% increase in June, and a 0.1% increase in May.
The Conference Board Lagging Economic Index (LAG) for the U.S. increased 0.6% in July to 108.5 (2016 = 100), following a 0.5% increase in June, and a 0.1% decline in May.
About The Conference Board Leading Economic Index (LEI) for the U.S.
The composite economic indexes are the key elements in an analytic system designed to signal peaks and troughs in the business cycle. The leading, coincident, and lagging economic indexes are essentially composite averages of several individual leading, coincident, or lagging indicators. They are constructed to summarize and reveal common turning point patterns in economic data in a clearer and more convincing manner than any individual component—primarily because they smooth out some of the volatility of individual components.
Suggested Items
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
03/21/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024
03/19/2024 | Globe NewswireManu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.
Management Change at Mycronic
03/19/2024 | MycronicAs a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan Li leaves Mycronic’s executive management but remains as Head of Axxon, the core of Mycronic´s High Volume division.
Intel Appoints Stacy Smith to Board of Directors
03/14/2024 | BUSINESS WIREIntel Corporation announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.
PCBAA Welcomes CHIPS Program Investing in American Made Substrates
03/05/2024 | PCBAAThe Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.