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Ventec Expands U.S. Team with New Director OEM Sales & Business Development
October 10, 2022 | VentecEstimated reading time: 1 minute
Ventec International Group Co., Ltd. is pleased to announce that Chad Wood has joined the company’s U.S. team. As Director OEM Sales & Business Development, Chad will drive business development, sales & support services for OEM customers predominantly in the Western region of the USA. His focus will be on Ventec’s core automotive, mil/aero, medical, lighting and network technology market segments, which typically require reliable thermal management materials (such as Ventec’s tec-thermal range) as well as high-speed and high-frequency material solutions (tec-speed).
Chad joins Ventec as an experienced technical sales leader who has worked in the electronics and semiconductor industries for more than 28 years. Since 2009, Chad has been involved in developing industry-leading thermal solutions for the most demanding applications that require sustainable and reliable materials that optimize product performance for tier-1 OEMs in the automotive, lighting, power and industrial, and telecom/datacom markets. From his home base in southern California, Chad will focus on bringing design wins and qualifications for all Ventec products from customers in the western region of the USA. He will also be responsible for Ventec's manufacturer rep sales teams on the west coast.
Chris Hanson, Global Head IMS Technology at Ventec comments: "Chad brings with him strong relationships with decision makers at the OEM and fabricator level. To support our continued growth, driven by a significant rise in demand for our solutions in the USA and beyond, our expanding team ensures that we continue to provide industry-leading technical support services. We are delighted to welcome Chad to Ventec as our latest member of the OEM sales team."
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
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Three Industry Leaders Receive IPC President’s Award
04/17/2024 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024.
Real Time with... IPC APEX EXPO 2024: IPC Government Relations Holds Lawmakers Accountable
04/16/2024 | Real Time with...IPC APEX EXPOThe IPC Government Relations team is constantly educating Congress and the executive branch about the importance of a robust domestic electronics manufacturing industry. As Richard Cappetto explains, the GR team is focused on proactive strategies, workforce policies, and sustainability, as well as the significance of apprenticeship programs, President Biden's executive order, and employer incentives. Also discussed is the PCB Act, its investment program, tax incentive, and DoD's understanding of supply chain risk.
Catching Up With Chasom Electronics
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Marcy's Musings: The Growing Industry
04/16/2024 | Marcy LaRont -- Column: Marcy's MusingsAfter decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating high-technology cutting-edge manufacturing processes, is now in a race to regain what it lost and then some. The PCB fabrication industry is growing in the West, thanks to DoD funding, the CHIPS and Science Act, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act.