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IPC to Unveil New Member Magazine ‘IPC Community’ at IPC APEX EXPO 2023
November 10, 2022 | IPCEstimated reading time: 1 minute
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
The quarterly magazine will be offered in a digital format and will serve as a valuable new resource designed to keep the IPC global community up to date on the latest IPC news, including industry updates, trends and technology.
The digital edition will be made available the week of January 22, 2023 at IPC APEX EXPO. The magazine will receive bonus circulation with printed copies exclusively available at the show.
Inside “IPC Community,” readers will find feature stories that celebrate member success along with articles on advocacy efforts, committee and standards updates, education and workforce training developments, factory of the future solutions, advanced packaging updates emerging engineer and member profiles, and more.
“Our members and the broader global electronics manufacturing community look to IPC as a steadfast resource to keep them informed and educated on the latest industry developments,” said Brian Knier, IPC vice president, marketing, member success and sales. “We’re excited about the possibilities of “IPC Community” taking our ability to disseminate timely and important information to the next level; all while making sure IPC members’ voices are reflected within the magazine.”
Added Michelle Te, IPC Community magazine managing editor, “Through its family of publications offering thought-provoking, original content, I-Connect007 prides itself in being ‘good for the industry.’ With the launch of IPC Community, IPC and I-Connect007 are now even better for the industry. There is much to recognize and celebrate.”
To subscribe to “IPC Community,” visit www.ipc.org/subscribe-ipc-community. For inquiries regarding advertising opportunities within the magazine, contact Barb Hockaday, ad sales manager, at barb@iconnect007.com. To suggest a member success story, contact Michelle Te at michelle@iconnect007.com.
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Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.