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ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

05/01/2024 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.

Micron First to Ship Critical Memory for AI Data Centers

05/01/2024 | Micron
Micron Technology, Inc. announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.

NextFlex Convenes the Hybrid Electronics Community at Binghamton University

05/01/2024 | NextFlex
Binghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking. 

NASA’s Optical Comms Demo Transmits Data Over 140 Million Miles

04/30/2024 | NASA JPL
NASA’s Deep Space Optical Communications experiment also interfaced with the Psyche spacecraft’s communication system for the first time, transmitting engineering data to Earth.

Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference

04/30/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
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