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epoxySet Unveils UC-2210M - Urethane for Electronic Component Protection
April 29, 2024 | epoxySetEstimated reading time: Less than a minute
epoxySet introduces a new and unique, urethane potting compound. The UC-2210M was formulated to protect electronic components in high moisture and thermal environments including constant atmospheric exposure, oceanographic environments and high humidity conditions.
This room temperature curing system is easy to apply as a potting, encapsulation or casting compound. The low viscosity allows for easy air removal as well as penetration of intricate encapsulated areas.
UC-2210M cures to a semi-rigid polymer that minimizes stresses on delicate and sensitive components. It has good thermally conductive thus further protecting electronics from heat stresses. Offering exceptional thermal shock from -55 to 130 °C, it also provides high impact resistance.
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epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
AT&S Brings High-Tech to the Museumsquartier
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Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
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