Welcome to I-007eBooks. Below you’ll find our comprehensive library of books written by industry experts on a variety of important topics. Peer-reviewed by topic specialists, I-007eBooks are the gold standard for technical education in the circuit board industry. Download your favorite title(s) free!
Review from Mike Cummings, Technical Director, TSI
"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."
Review from Steve Williams
"There is something here for everyone. I highly recommend downloading this book right away!"
Review from Duane Benson, Director of Marketing, Screaming Circuits
"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."
Review from Lambert Schutters, General Manager,
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Kyle Burk, PhD, President and Director of Engineering for KBJ Engineering, LLC
"This textbook is a great addition and supplement to the first edition. It delves deeper into the science of insulated metal substrates and their useful, often overlooked, properties for proper thermal management."
Review from Joe Smetana, Principal Engineer, Advanced Technology, Nokia
"This is an excellent primer on stackup design for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing."
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."
Review from Marius Stepanescu, Technical Director, ICCO EMT
"The Printed Circuit Assembler's Guide to... Smart Data explains the role of data acquisition and analytics in Industry 4.0. This book provides a very good description of the main challenges of collecting and handling smart data and analyzing it in the proper way."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Dr. Lothar Henneken, Sr. Expert and Six Sigma Blackbelt, Robert Bosch GmbH
"A must-read for everyone who wants to deal responsibly with the subject of humidity robustness and electrochemical reliability of electronics with the now new, valid state of the art for material and process qualification.
Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from Stephen V. Chavez, IPC Designers Council
"This is a great resource for those who wish to gain a better understanding of all that it takes to design a complex PCB/CCA in today’s ever-evolving industry. For a designer, challenges always include layout solvability, electrical integrity, and manufacturability. The goal is making revision one work. I refer to this as ‘The Designer’s Triangle’."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
Review from Kelly Dack, CID+, CIT, EPTAC Corporation
"Mark Thompson is not afraid to ask for what he needs from a customer to start a job with the end in sight. In fact, he does the industry one better in this book by telling you what a PCB fabricator needs to get the complex job done right. Much appreciated!
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Andy Shaughnessy, Managing Editor, Design007 Magazine
"This book will help the reader gain a comprehensive understanding of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies."
Review from Darren Smith, founding principal at AthenaTech
"A very thorough how-to that informs and enhances your project's ROI. Critical for designers new to RF layout or combining multiple impedance environments."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.
"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."
Review from Eric Bogatin
"If you care about signal integrity, you are sure to pick up a few nuggets of insight from this new eBook."
Review from Happy Holden
"Martyn Gaudion of Polar has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging e-book."
Review from David M. Griffith, BSc Geophysicist
"Must admit the philosophical arguments–e.g. simplification and welfare of all–caught my attention more than the technical stuff. I was able to keep up with the technical stuff (there's simplification for you) for the most part and the figures spoke volumes (a picture is indeed worth a thousand words) for the advantages of SAFE."
Review from Rick Hartley
"This book offers the greatest benefit to design and procurement people by helping them understand what can realistically be achieved in the final product."
Review from Kelly Dack
"The timing of this book release couldn't be better. Marrakchi takes the reader on a guided tour through the entire DFM process!"
Review from Andy Shaughnessy
"This may be the single best source of info about the AS9100 certification. Easy to digest yet full of details, it’s all here: from start to finish..."