Zulki's PCB Nuggets

Zulki’s PCB Nuggets: Smart Pills & Cameras—The Next Frontier for PCB Microelectronics

It's Only Common Sense

It’s Only Common Sense: It’s All About Content

The Plating Forum

The Plating Forum: Update on IPC-4552 ENIG Specification Revisions

Beyond Design

Beyond Design: My 100th Column

Smart Factory Insights

Smart Factory Insights: Trends and Opportunities at SMTAI 2019

Punching Out!

Punching Out! SMTAI 2019

Time to Market

Time to Market: The Importance of Timely NPI

Tim's Takeaways

Tim's Takeaways: Realizing a Higher Standard for PCB Design

Knocking Down the Bone Pile

Knocking Down the Bone Pile: Process Methods for Reworking High Lead Count SMT Parts

X-Rayted Files

X-Rayted Files: The Risk of Installing Counterfeit Parts

EPTE Newsletter

EPTE Newsletter: PCB Market Trends in Taiwan

Powerful Prototypes

Powerful Prototypes: Never Assume—A DFM Story

Defense Speak Interpreted

Defense Speak Interpreted: Other Transaction Authority

The Right Approach

The Right Approach: A Conversation With Prototron’s Van Chiem

Operational Excellence

Operational Excellence: Transform Your Operations With Nadcap

The Government Circuit

The Government Circuit: Recession Fears, Trade Wars: What Can We Do?

The PCB Norsemen

Altus' Axis

Altus' Axis: Is Your Soldering System Smart Enough for the Future?

Ladle on Manufacturing

Ladle on Manufacturing: Sunday Afternoon in Dongguan

SMT Solver

SMT Solver: Would You Prefer Shorts or Opens in Your Products?

The Pulse

The Pulse: Modelled, Measured, Mindful—Closing the SI Loop

SMT Perspectives and Prospects

Learn From the Wise

Lightning Speed Laminates

Lightning Speed Laminates: Practical Evaluations of Glass Weave Effect

More Than Just Dry Air

Controlling Oxidation and Intermetallics in Moisture-sensitive Devices

Mil/Aero Markets

The Fourth Pillar of Defense Acquisition: Cybersecurity

Quiet Power

Quiet Power: 3D Effects in Power Distribution Networks

Brooks' Bits

Brooks' Bits: Internal Trace Temperatures—More Complicated Than You Think

All About Flex

All About Flex: Terms and Conditions

Jumping Off the Bandwagon

The Proper Position to Take on Voids in Solder Joints

Bert's Practical Design Notes

Practical Modeling of High-Speed Backplane Channels

Launch Letters

Launch Letters: Myths about Millennials—Workplace Safety Matters

Let's Talk Testing

Let’s Talk Testing: Professor Plum in the Library with the Candlestick…Right?

The European Angle

CircuitData: A New Open Standard for PCB Fab Data Exchange

Software Bytes

Software Bytes: The Hiring Game

Millennials in Manufacturing

Millennials in Manufacturing: Hiring, Training and Retaining Millennials

The Essential Pioneer's Survival Guide

If It's My Data, I Can Do What I Want, Right?

Getting Connected with Social Media

Getting Connected with Social Media: Can You 'Game' the LinkedIn Publishing Algorithm?

Karl's Tech Talk

Karl's Tech Talk: Digital Imaging Update

The Short Scoop

Adapting Stencils to Manufacturing Challenges in 2015

Bob and Me

Controlled Impedance: A Real-World Look at the PCB Side

The Town Crier

True MCAD-ECAD Architecture: A Common-Sense Approach

From One Engineer to Another

Indium and Gallium: Playing Important Roles in LED Lighting and the 2014 Nobel Prize in Physics

Solving DAM Problems

Solving a True DAM Problem

Various Archived Columns

Conversations with...Integrated Micro-Electronics Inc.

SMT Trends & Technologies

LED the Sunshine In

SMT Trends & Technologies

What is Your Real Output?

The Sales Cycle

The Sales Cycle: Social Media - It's Nothing New...or Is It?

Fein-Lines

Fein-Lines: AI—Here and Changing the World

Language of Electronics

Language of Electronics: Key Considerations for Your Next Direct Imaging System

The Chemical Connection

The Chemical Connection: Engaging the Next Generation

Better to Light a Candle

Better to Light a Candle: A Solid Training Ground in New Hampshire

Design Circuit

Design Circuit: Green Ambition for the Electronics Manufacturing Industry

The New Chapter

The New Chapter: A Mini Manufacturing Ecosystem

Lean Digital Thread

Lean Digital Thread: The Manufacturing Metaverse Revisited

Nolan's Notes

Nolan’s Notes: Getting Real About Sustainability

Mr. Laminate Tells All

Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out

The Mannifest

The Mannifest:Tips for Today's SMT Challenges

Figure It Out

Figure It Out: Closing the Gap Between College and Industry with PCEA

The Doctor's In

The Doctor's In: How Health Smart Are Smartwatches?

The Shaughnessy Report

The Shaughnessy Report: A New Materials Paradigm

Sensible Design

Sensible Design: Automotive Conformal Coating Applications

Her Voice

Her Voice: The Intractable Ceiling

Global Sourcing Spotlight

Global Sourcing Spotlight: Six Keys to Successful Global Sourcing

PCB Talk

PCB Talk: Is DWM Just Another Buzzword?

Global Connections

Global Connections: Why We Need Wire

The Knowledge Base

The Knowledge Base: Building Reliable Electronics for Harsh Environments

The Bare (Board) Truth

The Bare (Board) Truth: My Top Six Design Challenges

Kramer on Counterfeits

A Summary of Counterfeit Avoidance: Development & Impact

Laser Pointers

Laser Pointers: Stepping Up to Laser Processing for Flex, Part 6 — Proper Care and Feeding of Your Equipment

Maxed Out

Maxed Out: Component Search Engine is a Total Game Changer

Material Insight

Material Insight: My Journey From Atomic Lattices to Circuit Boards

Putting It All Together

The Economics of Reducing Cycle Time in PCB Fabrication

Quest for Reliability

Quest for Reliability: Here We Go (Virtual) Again

Adventures in Engineering

Adventures in Engineering: A Penny Primer on PCB Design Fundamentals

Happy’s Tech Talk

Happy’s Tech Talk #19: Next-generation Electroplating Systems

The Big Picture

The Big Picture: A New Globalization

Fresh PCB Concepts

Fresh PCB Concepts: PCBs for Harsh and Extreme Environments, Part 2

All Systems Go

All Systems Go: Auto-Detecting Over- and Under-Derated Parts

Flexible Thinking

Flexible Thinking: Catalyzing Change and Design Evolution

Designer's Notebook

Designer's Notebook: PCB Design for Bare Board Testing

From the Hill

From The Hill: Pillars of Mil-Aero Technology and Revenue

Maggie Benson's Journey

Maggie Benson’s Journey: The Tale of the Cost-Estimate Problem

Consider This

Consider This: Designing Via-in-Pad for Higher Density Flexible Circuits

Dan's Biz Bookshelf

Dan’s Biz Bookshelf: ‘Talent Tectonics’

Standard of Excellence

Standard of Excellence: Three Tools to Deliver Great Customer Service

Flex Time

Flex Time: Alternative Constructions in Rigid-flex Designs

Additive Reality

Additive Reality: Drop It, and Enjoy the Greenback

Testing Todd

Testing Todd: Preparing Employees for the Long Haul

The Digital Layout

The Digital Layout: A Different Kind of Additive Manufacturing

Dana on Data

Dana on Data: Can ChatGPT Solve My PCB Data Transfer Quality Problem?

Circuit Chronicles

Circuit Chronicles: It’s All About the Team

Trouble in Your Tank

Trouble in Your Tank: Electrodeposition of Copper, Part 4—Addition Agents

SMT Stencils 101

SMT Stencils 101: Root-cause Stencil Design, Part 3—Tearing Down Bridges

Elementary, Mr. Watson

Elementary, Mr. Watson: Slash Sheets a ‘Smorgasbord’ of Materials

Digital Transformation

Digital Transformation: Leveraging Digital Automation to Accelerate PCB Design

Global Technology

Global Technology: The Importance of Fine Lines

Target Condition

Target Condition: The Tale of Five CAD Monkeys

One World, One Industry

One World, One Industry: Advanced Packaging Year in Review

Connect the Dots

Connect the Dots: What is an Annular Ring?

Foundations of the Future

Foundations of the Future: IPCEF's Scholarships, Awards and Student Opportunities