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Bürkle North America and Schmoll Maschinen Separating After 20 Years

03/25/2024 | Burkle North America
Bürkle North America and Schmoll Maschinen, two leading companies supplying state-of-the-art equipment to Printed Circuit Board manufacturers, have announced an amicable separation, effective April 3.

Benmayor to Exhibit Technosystem Automation at IPC APEX EXPO 2024

03/25/2024 | Benmayor
Benmayor will exhibit Technosystem Automation at the IPC APEX EXPO 2024, a world-class trade show and cutting-edge technical conference in Anaheim, California, April 6-11, in booth 4432 at Burkle North America (Schmoll).

UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

SEMI Applauds U.S. Chips Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply

03/21/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support four new Intel Corporation semiconductor manufacturing sites in the states of Arizona, New Mexico, Ohio and Oregon.

Koh Young America Appoints Heriberto Cuevas as Sales Team Leader for Mexico and South America

03/19/2024 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, proudly announces the appointment of Heriberto Cuevas as the Sales Team Leader for its Mexico and South America operations.
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