Cognifiber Downsizes its System for Edge Computing With Breakthrough Glass Processors
March 31, 2022 | CognifiberEstimated reading time: 2 minutes
The limitations of edge computing put a strain on connected devices to store, transfer, and manage data. “The miniaturization capabilities of glass-based photonic chips will bring server-size products to the edge,” said Dr. Eyal Cohen, Co-founder & CEO of Cognifiber.
Cognifiber, a deep technology company focusing on revolutionizing photonic computing, announced the development of a glass-based photonic chip that will bring its technology one step closer to revolutionizing edge computing. Being the first of its kind, this glass-based chip reduces power consumption and takes a fraction of the size of previous designs in CogniFiber’s solutions.
Edge devices, including smart meters, smart home assistants, connected vehicles, and other IoT devices, rely primarily on cloud computing to rapidly recognize patterns and act in a seamless manner. Today, due to the edge devices' size and power limitations, they require a constant uplink with data centers, which face their own problems surrounding capacity and power consumption. Existing edge solutions may include low-power chips; however, these may limit speed, model size, and accuracy. To address this problem, Cognifiber is developing glass-based photonic chips that reduce its data center rack-size systems to a mere 4U server (~18cm high), making it deployable in any office.
“The downsizing potential using glass-based photonic chips in conjunction with our proprietary fibers promises to bring superb-performance servers to the edge, removing many existing bottlenecks while dramatically reducing power consumption,” said Dr. Eyal Cohen, Co-founder & CEO of Cognifiber. “Anything that generates vast amounts of data every second, such as connected vehicles, automated trains, or fleet management of large shipment drones can respond in real-time to events without reliance on data centers.”
Cognifiber has already set the stage for reimagining Moore’s Law. Replacing legacy silicon-based semiconductors, they are already in the advanced stages of developing in-fiber processing that minimizes the reliance on chips altogether by conducting complex computations within specialty optical fiber. “The future of computing demands a whole new way of transferring and processing vast amounts of data,” said Professor Ze’ev Zalevsky, Co-founder & CTO of Cognifiber. “Combining photonic glass chips promotes our edge solution to bring rapid AI and Machine Learning locally to edge devices, which are limited in their capacity and power allowance.”
Even with in-fiber processing, which can deliver a 100-fold boost in computing capabilities, there is still a reliance on semiconductors to conduct various operations of control and training. Future glass photonic chips, beyond downsizing, may provide a replacement for today’s silicon ones, while reducing manufacturing costs, power consumption, and the removal of bandwidth bottlenecks.
This giant leap for the photonics industry creates the foundation for future capabilities while companies rely on edge devices to make increasingly complex autonomous decisions. “Devices will react faster and more reliably with our expected edge computing capacity,” said Cohen.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.