-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ESI's Most Extensible Laser Micromachining Platform Delivers Efficient Manufacturing for Consumer Electronics
June 25, 2015 | ESIEstimated reading time: 2 minutes
Electro Scientific Industries, Inc., an innovator of laser-based manufacturing solutions for the micromachining industry, today introduced Jade™, the new low-cost, high-volume-production laser micromachining platform adaptable to a range of configurations for different applications including cutting, marking, drilling and engraving.
The new platform addresses challenges faced by manufacturers in the fast-changing consumer electronics segment where they cope with new materials, new technologies and evolving consumer expectations. Meanwhile, there is relentless pressure to reduce costs, meet quality requirements and achieve high-volume high-yield production. The Jade™ platform is the first laser micromachining platform capable of meeting all these diverse requirements, offering unprecedented levels of versatility and cost-efficient operation.
"Production requirements in consumer electronics are constantly changing with new materials and features that require a range of laser micromachining processes that can be delivered quickly and at an attractive cost of ownership," said Edward C. Grady, President and CEO of ESI. "We are directly addressing this challenge with the Jade™ platform. Designed by ESI's cooperative China-USA engineering operation, this low-cost platform is adaptable, reliable, and locally built and serviced by our support teams on the ground in China."
The Jade™ platform is designed to provide contract and consumer electronics manufacturers with a smarter manufacturing option through the use of extendable and configurable stages, lasers, and automation. The base platform can be configured with multiple laser and optics options as well as a range of add-on options including pre- and post-inspection, metrology and advanced alignment automation. All configurations use a common user interface to reduce training time.
This flexibility means that a Jade™ platform can address multiple marking, cutting, and drilling applications in a responsive and cost-effective manner, improving the useful lifespan of the tool and significantly lowering overall cost of ownership for our customers. The Jade™ platform continues ESI's commitment to reliability, responsive local support in China, and to meeting expectations for precision and high-volume yields.
Availability
The Jade™ Series of platforms are available now in China, Vietnam, India, Korea and Taiwan. For more information go to www.esi.com.
About ESI
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024
04/22/2024 | IPCThe IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership.