-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Inventec Launches Enhanced Co-Solvent
September 10, 2015 | InventecEstimated reading time: 2 minutes
For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process.
The cleaning action to remove baked-on solder flux residues after reflow, also known as defluxing, from printed circuit boards and power semiconductors has become more and more challenged because of the higher densities in today’s electronics, miniaturization, lower stand off components, and complex geometries This situation becomes even more difficult in lead free assembly where higher process temperatures are applied causing charring to flux residues.
The Topklean EL20P is the newest product in the range, it has been designed in response to the latest defluxing needs, formulated to have an outstanding capillary action by taking into consideration two main parameters: the penetration coefficient and the solvency power, it has a lower surface tension compared to other co-solvent agents in the market. The high wetting performance of Topklean EL20P allows to efficiently clean lead free fluxes after reflow which are hard to remove. Miniaturization and advanced packaging should not become a challenge for reliability anymore.
The main benefits offered by Topklean EL20P are:
- Enhanced solvency power to dissolve and remove Lead Free flux residues
- Faster cycle time due to its higher solvency and rinsing capabilities
- Lower ionic contamination
- Improved environmental performance. It is not toxic, it has a very low environmental impact and its formulation includes a high percentage of renewable raw materials.
- Great materials compatibility including labels placed on PCBA before cleaning process.
- Fully compatible with main vapour phase cleaning systems available in the market
Topklean EL20P is available worldwide in 20 l and 200 l drum containers.
About Inventec Performance Chemicals
Inventec is a division of the Dehon Group with head offices in Vincennes, France. The Electronic Business Unit is specialised in developing, manufacturing and supplying soldering, cleaning & coating materials used in the assembly of printed circuit boards and semiconductor packaging, contributing to sustainable development for high tech industries including automotive, telecom, industrial, energy, LED lighting, rail, aerospace, military and semiconductor. Inventec has 11 subsidiaries around the world, and production sites in France, Switzerland, Malaysia, China, United States and Mexico; all ISO 9001 certified and equipped with control and application laboratories to guarantee traceability, compliance with industry standards and consistency from batch to batch.
Suggested Items
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/09/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized the purchase of a Pulsar solderability testing system.