Latest Electronics Industry News

Stellantis, Foxconn Partner to Design, Sell New Flexible Semiconductors for Automotive Industry
New Today | Foxconn
BGA Device for Embedded Applications: EM-30 from Swissbit Available Now
New Today | Swissbit AG
EMD Electronics Announces $1 Billion Investment in U.S. to Support Semiconductor Customers
New Today | PRNewswire
Wearables Shipments Grew 9.9% in Q3 of 2021
New Today | IDC
SEMI Americas, Semiconductor Digest Announce 2021 Best of West Award Finalists
New Today | SEMI
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
New Today | Siemens
Global Semiconductor Sales Increase 24% YoY in October
12/06/2021 | SIA
Keysight Joins Anterix Active Ecosystem Program to Advance Private LTE Broadband Deployments in the U.S.
12/06/2021 | Keysight Technologies, Inc.
Siemens’ mPower Solution Achieves Certification for Advanced Analog IC Foundry Process Technologies
12/06/2021 | Siemens
LPKF Opens Biolab for ARRALYZE Technology
12/06/2021 | LPKF
Stanford Engineers Propose a Simpler Design for Quantum Computers
12/06/2021 | Stanford University
Keysight Joins Anterix Active Ecosystem Program to Advance Private LTE Broadband Deployments
12/03/2021 | Keysight Technologies, Inc.
Stanford Engineers Create Perching Bird-like Robot
12/03/2021 | Stanford University
ASE to Divest Holdings in Subsidiaries to Wise Road Capital
12/03/2021 | ASE Technology Holding Co., Ltd.
Lockheed Extends Ion Storage Relationship
12/03/2021 | Business Wire
BAI Communications Acquires Wireless Infrastructure Leader Vilicom
12/02/2021 | PRNewswire
Microchip Continues Expansion of Gallium Nitride (GaN) RF Power Portfolio
12/02/2021 | GlobeNewswire
DOCOMO, NEC Successfully Test 5G Standalone
12/02/2021 | ACN Newswire
Cadence Expands Collaboration with TSMC and Microsoft
12/02/2021 | Cadence Design Systems, Inc.
Global Semiconductor Equipment Billings Jump 38% YoY in Q3 2021
12/01/2021 | SEMI
Stanford Physicists Help Create Time Crystals with Quantum Computers
12/01/2021 | Stanford University
Comtech Awarded 5G Contract with Canadian Tier-One Carrier
12/01/2021 | Business Wire
Qualcomm, Google Cloud Collaborate on Neural Architecture Search for the Connected Intelligent Edge
12/01/2021 | Qualcomm Technologies, Inc.
CEOs Call on Congress to Strengthen U.S. Semiconductor Research, Design, Manufacturing
12/01/2021 | SIA
Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry
12/01/2021 | PRNewswire
SEMICON West 2021 to Gather Visionaries to Explore New Semiconductor Supply Chain Strategies, Opportunities
11/30/2021 | SEMI
Cigniti Enhances its 5G Assurance Focus with innovate5G Partnership
11/30/2021 | Business Wire
IoT CMP Vendors Add eSIM Management Capabilities to Simplify Logistics, Localize Connectivity
11/30/2021 | Berg Insight
Introducing Intel’s Long-Term Retention Lab
11/30/2021 | Intel
Siemens Partners with Hyundai Motor Company and Kia Corporation for Digital Mobility Transformation
11/30/2021 | Siemens


New Device Modulates Visible Light with the Smallest Footprint and Lowest Power Consumption
11/29/2021 | Columbia Engineering
A New Artificial Material Mimics Quantum Entangled Rare Earth Compounds
11/29/2021 | Aalto University
Nokia, Ooredoo Group Sign Strategic 5-year Agreement, Including 5G
11/29/2021 | GlobeNewswire
Peplink Sees Large Growth in 5G Demand as Partnership with M2M Connectivity Expands
11/26/2021 | GlobeNewswire
A*STAR, STMicroelectronics Team Up on Silicon Carbide R&D for EV Market, Industrial Applications
11/26/2021 | GlobeNewswire
Micron, UMC Announce Global Settlement
11/26/2021 | Micron
Ultrathin Solar Cells Get a Boost
11/26/2021 | Rice University
Intel Teams with Snowflake
11/26/2021 | Intel
NexOptic Optimizating on Qualcomm Technologies’ Snapdragon Mobile Platforms
11/25/2021 | GlobeNewswire
Intel Powers New Amazon EC2 Instance
11/25/2021 | Intel
Mavenir Announces Commercial Availability of 4G Open RAN-based Outdoor Small Cell
11/25/2021 | Business Wire
Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement
11/24/2021 | ANSYS
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas
11/24/2021 | Samsung
Next Generation Efforts in Wireless Communications Move Forward
11/23/2021 | Business Wire
2022 Will Mark a New Era for Wireless Innovation
11/23/2021 | PRNewswire
Siemens Reconfirms Commitment to Shipbuilding 4.0 with CESENA Opening
11/23/2021 | Siemens
Study: Semiconductor Supply Chain Remains Vulnerable Without Federal Investment
11/23/2021 | IPC
North American Semiconductor Equipment Industry Posts October 2021 Billings
11/23/2021 | SEMI
Rice Research: AI Technology No Silver Bullet for Hiring the Best Employees
11/22/2021 | Rice University
Keysight, Proventia Collaborate to Optimize Electric Vehicle Battery Test Solutions
11/22/2021 | Keysight Technologies, Inc.
Ericsson to Acquire Vonage for $6.2 Billion
11/22/2021 | PRNewswire
Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications
11/22/2021 | Cadence Design Systems, Inc.
Qualcomm Sets New Growth Targets and Financial Guidance Through Fiscal 2024
11/22/2021 | Qualcomm Incorporated
Ford, Purdue Patent Charging Station Cable for Quick EV Charge Research
11/19/2021 | Purdue University
Finnish Tampere Deck Arena Now Nokia Arena
11/19/2021 | GlobeNewswire
Realtek, Ansys Accelerate Complex IC Design for RFIC & High-Speed IC with Advanced Simulation Workflow
11/19/2021 | ANSYS
Intel’s Habana Labs Announces Turnkey AI Training Solution
11/19/2021 | Intel
Siemens Adds NVH System Prediction Capabilities to Simcenter Portfolio
11/19/2021 | Siemens
DuPont, Kempur Microelectronics Announce Collaboration
11/18/2021 | DuPont
Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack
11/18/2021 | Cadence Design Systems, Inc.


Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification
11/18/2021 | PRNewswire
Pushing the Limits of Electronic Circuits
11/18/2021 | MIT
SIA Applauds Bicameral Agreement on Path Forward for USICA
11/18/2021 | SIA
Nokia Announces Entry into Software-as-a-Service for CSPs with Multiple Services
11/17/2021 | GlobeNewswire
Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library
11/17/2021 | Cadence Design Systems, Inc.
Siemens Extends Support of Multiple IC Design Solutions for Samsung Foundry’s Process Tech
11/17/2021 | Siemens
Weak Bonds a Strength in Making Borophene
11/16/2021 | Rice University
Qualcomm, BMW Group to Extend Their Long-Lasting Technology Collaboration to Automated Driving
11/16/2021 | PRNewswire
Stanford Professors to be Honored for Excellence in Semiconductor Research
11/16/2021 | SIA
Lattice Acquires Mirametrix
11/16/2021 | Lattice Semiconductor
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm, 4nm Process Technologies
11/15/2021 | ANSYS
Athonet Announces Bring Your Own RAN Program for Private Networks
11/15/2021 | PRNewswire
Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards
11/15/2021 | Cadence Design Systems, Inc.
DOCOMO Develops Blade-free Drone Fitted with High-res Camera and LEDs
11/15/2021 | JCN Newswire
Keysight’s 5G Test Platforms Selected by Ti Group for Wireless Device Conformance Validation
11/12/2021 | Business Wire
Nokia Calls for Accelerated Digitalization and Green Energy Uptake
11/12/2021 | GlobeNewswire
Empower Semiconductor Signs Global Distribution Agreement with Mouser Electronics
11/12/2021 | PRWEB
Siemens’ AM Network to Facilitate Additive Manufacturing Workflow, Collaboration at Schaeffler
11/12/2021 | Siemens
Untangling Quantum Information at Columbia
11/11/2021 | Columbia University
FORESEE SPI NAND Flash: A Must-have Chip for 5G Devices
11/11/2021 | PRNewswire
Samsung, Orange Collaborate to Advance 5G Networks to a New Level
11/11/2021 | Samsung
Storing Energy in Plants with Electronic Roots
11/11/2021 | Linköping University
SEMICON West 2021 Hybrid to Highlight Solutions to Global Challenges, Smart Technologies, Talent
11/11/2021 | SIA
Surrey Researchers Reveal the Hidden Behaviour of Supercapacitor Materials
11/10/2021 | University of Surrey
OE-A Business Climate Survey – Printed Electronics Industry Proves Resilience
11/10/2021 | OE-A
Renesas Expands 5G mmWave Beamformer Portfolio With Transmitter Output Power Capability
11/10/2021 | Business Wire
Samsung Develops Industry’s First LPDDR5X DRAM
11/10/2021 | Business Wire
IBM Study: CIOs' Influence is Growing as Technology Becomes Core to Surveyed Enterprises
11/09/2021 | IBM
Altair Relaunches Startup Program
11/09/2021 | Altair
Ansys Selected by Panasonic Automotive for Future Mobility Technology
11/09/2021 | ANSYS


KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan
11/09/2021 | PRNewswire
IDC FutureScape: Top 10 Predictions for the Future of Digital Infrastructure
11/08/2021 | Business Wire
Navitas Introduces Third Generation GaN Power IC with GaNSense Technology
11/08/2021 | PRNewswire
Ambarella Closes Acquisition of Oculii
11/08/2021 | GlobeNewswire
Gatik, Walmart Achieve Fully Driverless Deliveries
11/08/2021 | Business Wire
SEMI: Global Silicon Wafer Shipments Reach Record High in Q3 of 2021
11/08/2021 | SEMI
Researchers Discover Predictable Behavior in Promising Material for Computer Memory
11/05/2021 | Georgia Tech
5G mmWave Large-Scale Rollout: IDTechEx Discusses If and When
11/05/2021 | PRNewswire
Siemens Named 'Leader' in Industrial Internet-of-Things Software Platforms Q3 2021 Report
11/05/2021 | Siemens
Samsung, Alphawave IP Announce Acceleration of Deep Partnership
11/05/2021 | GlobeNewswire
Copyright © 2021 I-Connect007. All rights reserved.