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Intel Announces 2024 EPIC Supplier Program Award Recipients
Intel announced the recipients of the 2024 Intel EPIC Supplier Program awards, which recognize suppliers that exemplify Intel’s standard of...
Q2 NAND Flash Contract Prices Expected to Rise by 13–18%, Enterprise SSDs to See Highest Increase
TrendForce projects a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and...
Murata Selected as a Clarivate Top 100 Global Innovator for 3rd Year in a Row
Murata Manufacturing Co., Ltd. was selected as one of the Clarivate Top 100 Global Innovators 2024 by Clarivate Analytics in March 2024. This is the...
Breaking News: MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth...
Camtek Receives Approx. $25M from Tier-1 Manufacturer for High Bandwidth Memory (HBM)
Camtek Ltd. announced that it has received a new order for approximately $25 million from a tier-1 HBM manufacturer, for the inspection and metrology...
Ansys, NVIDIA Pioneer Next Era of Computer-Aided Engineering
Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative...
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Intel Announces 2024 EPIC Supplier Program Award Recipients
March 29, 2024 | Intel Corporation
Q2 NAND Flash Contract Prices Expected to Rise by 13–18%, Enterprise SSDs to See Highest Increase
March 29, 2024 | TrendForce
Murata Selected as a Clarivate Top 100 Global Innovator for 3rd Year in a Row
March 29, 2024 | Murata Manufacturing Co., Ltd.
Camtek Receives Approx. $25M from Tier-1 Manufacturer for High Bandwidth Memory (HBM)
March 29, 2024 | Camtek
Ansys, NVIDIA Pioneer Next Era of Computer-Aided Engineering
March 29, 2024 | ANSYS
Recommended Cash Offer by Keysight for Spirent Communications PLC
March 29, 2024 | Keysight Technologies, Inc.
AST SpaceMobile ASIC Chip Enters Tape-Out Phase in Collaboration with TSMC
March 28, 2024 | BUSINESS WIRE
Ambiq Apollo510 Delivers 30x Power Efficiency Improvement to Unleash Endpoint AI
March 27, 2024 | Ambiq
Embedded World 2024: Rohde & Schwarz Presents its Cutting-edge Test Solutions for Embedded Systems
March 27, 2024 | Rohde & Schwarz
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
March 27, 2024 | SEMI
IPC APEX EXPO 2024 Pre-show Featuring:
- What’s Next Becomes Now by Dr. John Mitchell
- Dip Your Hand in the IPC APEX EXPO Candy Jar by Hannah Grace
- Electronics Circuit World Convention: A Brief History by David Bergman
- Keynote Preview: Reshaping our Engagement With the World by Shawn DuBravac
- ECWC16 Technical Conference Special Sessions by Julia Gumminger
- EMS Roundtables: Leaders Helping Each Other by Glenna Carrell
The Sustainability Issue Featuring:
- The Delicate Balance of Sustainable Business and Going Green with Alex Stepinski
- Attracting ‘Generation Green’ by Paige Fiet
- Sustainability Challenges: A Collaborative Approach by John Mitchell
- Reducing Etch Water System Usage, Part 1 by Don Ball
- Water Management in a Large Printed Circuit Board Manufacturer by Charles Nehrig
- An Ultimate Goal in Sustainability: Recyclable PCBs with Jan Pedersen
- Designing for Cost and Sustainability with Erik Pedersen
Opportunities and Challenges Featuring:
- Great Opportunities—and Challenges, with John Watson
- Being the Best Design Engineer, with Bill Hargin
- The Art of Technical Instructions, by Tim Haag
- The Art of Presenting PCB Design Courses, by Barry Olney
- PCB Designers Still Wanted, by Joe Fjelstad
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