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FEATURED ARTICLES AND COLUMNS:

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

April 26, 2024 | Andy Shaughnessy, Design007 Magazine

In this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.

The Right Approach: I Hear the Train A Comin'

April 25, 2024 | Steve Williams, The Right Approach

Training is often an afterthought in many organizations, and the longer a company has been in business, the more this seems to apply. Over the past couple of decades, it has been amazing to observe that the biggest offenders of this are the companies that overuse the sound bite, “Our most important assets are our people.” When you dig into the process and peel back the onion, their commitment to training is not commensurate with that statement.





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It’s Only Common Sense: OCCAM—the Time Is Now

April 22, 2024 | Dan Beaulieu, It's Only Common Sense

One of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so...

Marcy's Musings: The Growing Industry

April 16, 2024 | Marcy LaRont, Marcy's Musings

After decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating...

Material Insight: The Importance of Standards for the Chip Packaging Industry

April 12, 2024 | Dr. Preeya Kuray, Material Insight

I had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across...

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